1. Elements of Structural Analysis. - 1. Rods. - 2. Beams. - 3. Plates. - 4. Thermal Stress. - 5. Plastic Beam Deformation. - 6. Energy Methods in Structural Analysis. - 7. Experimental Methods of Analysis. - References. - 2. Finite Element Analysis. - 1. Preliminaries. - 2. Direct Stiffness Matrix Approach. - 3. The Principle of Minimum Potential Energy. - 4. Element Types. - 5. Finite Element Dynamic Analysis. - 6. Stress and Strain Calculations. - 7. Structural Codes. - 8. Steps in the Use of Finite Element Analysis. - References. - 3. Components Data and Testing. - 1. Modules. - 2. Circuit Cards and Boards. - 3. Pin Leads of PGA Modules. - 4. Strength of Compliant Leads in Surface-Mount Construction. - 5. Stiffness of Compliant Leads. - 6. Solder Strength. - References. - 4. Leadless Chip Carriers. - 1. Loads and Materials. - 2. Thermal Stress Analysis. - 3. The Influence of Solder Joint Shape. - 4. Constitutive Equation for Solder Mount. - 5. Conclusions. - 6. Exercises and Questions. - References. - 5. Thermal Stress in Pin-Grid Arrays: Primary Analysis ofPins. - 1. Introduction. - 2. Elastic Foundation Modulus of a Soldered Pin. - 3. Elastic Foundation Treatment for the Embedded Pin. - 4. Solder Pressure Calculation. - 5. Plastic Analysis of the Pin. - 6. Axial Pin Force Due to Flexure. - 7. A Magnified-Scale Experiment. - 8. Conclusions. - 9. Exercises and Questions. - References. - 6. Thermal Stress in Pin-Grid Arrays: Interaction Between Module and Circuit Card. - 1. Pin Force Analysis Due to Module and Card Bending. - 2. Influence of Pin-End Moments. - 3. Influence of the Primary Axial Pin Forces. - 4. Influence of Secondary Axial Pin Forces. - 5. Solution of the System of Equations. - 6. Module and Card Stretch Due to Pin Shear. - 7. System Reduction Factor. - 8. Conclusions. - 9. Exercises and Questions. - References. - 7. Compliant Leaded Systems: The Local Assembly. - 1. Experimental Studies. - 2. Analytical Model. - 3. Properties of Simple Local Assemblies. - 4. Discrete Local Assembly. - 5. Built-up (Multiple-Module) Local Assemblies. - 6. Orthotropy of Local Assemblies. - 7. Module Group Assemblies. - 8. Conclusions. - 9. Exercises and Questions. - References. - 8. Bending in Compliant Leaded Systems. - 1. The Role of Leads. - 2. Application of the Finite Element Method. - 3. Strip Method. - 4. Building Block Method. - 5. Hybrid Experimental/Analytical Method. - 6. Conclusions. - 7. Exercises and Questions. - References. - 9. Approximate Engineering Theory for the Twisting of Compliant Leaded Circuit Card/Module Systems. - 1. Fundamental Approach. - 2. Torsional Stiffness Calculation. - 3. Rectangular Cards with a Module. - 4. Module Clusters. - 5. Finite Element Check of the Approximate Theory. - 6. Conclusions. - 7. Exercises and Questions. - References. - 10. Analytical Theory and Experimental Work in Compliant Leaded Systems Subjected to Twisting. - 1. Analytical Theory. - 2. Torsional Stiffness. - 3. Experimental Study. - 4. Large Displacements. - 5. Approximate Large Displacement Analysis of a Square Card. - 6. Torsional Fatigue. - 7. Conclusions. - 8. Exercises and Questions. - References. - 11. Thermal Stresses in Compliant Leaded Systems. - 1. Motivation for Analysis. - 2. Analytical Lead Stress Computation. - 3. Finite Element Thermal Stress Analysis. - 4. Stress Reduction in Compliant Leaded Solder Joints. - 5. Thermal Fatigue in Solder Joints of Compliant Leads. - 6. Thermal Cycling Reliability. - 7. Exercises and Questions. - References. - 12. Dynamic Response of Circuit Card Systems. - 1. General Considerations. - 2. Dynamic Load Levels and Measurement. - 3. Vibration Analysis in Circuit Card Systems. - 4. Transient Vibration and Shock Response. - 5. Fatigue Considerations. - 6. Conclusions. - 7. Exercises and Questions. - References. - 13. Plated Holes in Cards and Boards. - 1. Introduction. - 2. Thermal Stress from Module-to-Card Mismatch. - 3. Thermal Stress from Barrel-to-Board Mismatch. - 4. Experimental Methods. - 5. Vias. - 6. Conclusions. - 7. Exercises and Questions. - References. - 14. Assembly of Cards and Boards. - 1. Physical Description. - 2. ZIF Connector Actuation. - 3. Connector Contact. - 4. Dynamic Response. - 5. Thermal Stress. - 6. A Combined Permanent and Separable Connector System. - 7. Conclusions. - 8. Exercises and Questions. - References. - Author Index. Language: English