Modeling Analysis Design and Tests for Electronics Packaging beyond Moore
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Modeling Analysis Design and Tests for Electronics Packaging beyond Moore
- Brand: Unbranded
Modeling Analysis Design and Tests for Electronics Packaging beyond Moore
- Brand: Unbranded
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Description
- Brand: Unbranded
- Category: Education
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Artist: Zhang Hengyun
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Format: Paperback
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Language: English
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Publication Date: 2019/11/15
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Publisher / Label: Elsevier Science
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Number of Pages: 434
- Fruugo ID: 337311746-740938178
- ISBN: 9780081025321
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